頎邦科技股份有限公司

LEI: 254900AK7VTHB4UYLR40

Entity

Legal Name

頎邦科技股份有限公司

Language Code

Legal Name (English)

CHIPBOND TECHNOLOGY CORPORATION

Legal Address (English)

No.3 Li Hsin 5th Rd. Hsinchu Science Park Hsinchu, 300094 TAIWAN

Headquarters Address (English)

No.3 Li Hsin 5th Rd Hsinchu Science Park Hsinchu, 300094 TAIWAN

Other Addresses (Local Language)

Other Address 1

Address

新竹科學園區力行五路三號新竹市, 300094 TAIWAN (TW)

Type

ALTERNATIVE_LANGUAGE_LEGAL_ADDRESS

Language Code

Other Address 2

Address

新竹科學園區力行五路三號新竹市, 300094 TAIWAN (TW)

Type

ALTERNATIVE_LANGUAGE_HEADQUARTERS_ADDRESS

Language Code

Legal Jurisdiction Country

TAIWAN (TW)

Registration Authority

Registration Authority ID

Ministry of Economic Affairs (RA000551)

Registration Authority Entity ID

16130009

Entity Legal Form Code

Other (8888)

Other Legal Form

企業

Entity Category

GENERAL

Entity Status

ACTIVE

Entity Creation Date

1997-07-02 00:00:00

Relationships

Direct Parent

Parent Information Not Provided

Non-Disclosure Reason 1

Reason

NO_KNOWN_PERSON

Ultimate Parent

Ultimate Parent Same As Direct Parent

Registration

Initial Registration Date

2018-01-05 17:47:40

Last Update Date

2024-10-09 16:45:57

Next Renewal Date

2025-10-09 16:45:57

Registration Status

ISSUED

Managing LOU

5493001KJTIIGC8Y1R12

Validation Sources

FULLY_CORROBORATED

Validation Authority

Validation Authority ID

Ministry of Economic Affairs (RA000551)

Validation Authority Entity ID

16130009