厦门润量半导体材料科技有限公司

LEI: 83680050N972H42T3D35

Entity

Legal Name

厦门润量半导体材料科技有限公司

Legal Name Language Code

Legal Address

厦门市集美区集美大道1302号创业大厦第六层613单元之四厦门市, Fujian Sheng (CN-FJ), 361000 CHINA

Headquarters Address

厦门市集美区集美大道1302号创业大厦第六层613单元之四厦门市, Fujian Sheng (CN-FJ), 361000 CHINA

Legal Jurisdiction Country

CHINA (CN)

Registration Authority

Registration Authority ID

State Administration for Market Regulation (RA000092)

Registration Authority Entity ID

91350211MA33FLDY5Y

Entity Legal Form Code

qi ye (ECAK)

Entity Category

GENERAL

Entity Status

ACTIVE

Relationships

Direct Parent

Parent Information Not Provided

Non-Disclosure Reason 1

Reason

NON_CONSOLIDATING

Ultimate Parent

Parent Information Not Provided

Non-Disclosure Reason 1

Reason

NON_CONSOLIDATING

Registration

Initial Registration Date

2021-12-17 03:39:22

Last Update Date

2022-03-01 06:34:07

Next Renewal Date

2022-12-17 03:39:22

Registration Status

LAPSED

Managing LOU

655600IJ8LS3CCDA4421

Validation Sources

FULLY_CORROBORATED

Validation Authority

Validation Authority ID

State Administration for Market Regulation (RA000092)

Validation Authority Entity ID

91350211MA33FLDY5Y